Applications
- ALD and CVD process development
- Precursor and new process R&D
- Atomic layer etching (ALE) development
- Engineering processes for certain high aspect ratio 3D device structures
- Kinetic modelling of ALD, CVD and ALE
- Process quality control and assurance
Benefits
- Customer-neutral and accessible test structures
- Save time and costs using conventional surface analysis tools instead of electron microscopy cross-sections
- Record-high aspect ratios (10 000:1) to quantify figure-of-merits for conformality
- Submicrometer limiting dimensions define the molecular flow regime relevant for modelling
- Accurate and reliable information for quality assurance and fundamental process characterization
- Wide compatibility to various conditions (temperature, pressure, IC cleanliness)